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67SLH080080080PI00 Laird Technologies EMI RFI and EMI - Contacts Fingerstock and Gaskets

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Description of your requirements:

Mfr: Laird Technologies EMI
Series: SMD Grounding Metallized
Package: Tape & Reel (TR); Cut Tape (CT); Digi-Reel®
Product Status: Active
Type: Film Over Foam
Shape: Hourglass
Width: 0.315\ (8.00mm)
Length: 0.315\ (8.00mm)
Height: 0.315\ (8.00mm)
Material: Polyurethane Foam Tin-Copper Polyester (SN/CU)
Plating: -
Plating - Thickness: -
Attachment Method: Solder
Operating Temperature: -40°C~70°C
Shelf Life Start: -
Shelf Life: -
Storage/Refrigeration Temperature: -

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