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67B3G3006010010R0C Laird Technologies EMI RFI and EMI - Contacts Fingerstock and Gaskets

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Description of your requirements:

Mfr: Laird Technologies EMI
Series: B3G
Package: Bulk
Product Status: Active
Type: Fingerstock
Shape: -
Width: 0.119\ (3.00mm)
Length: 0.236\ (6.00mm)
Height: 0.394\ (10.00mm)
Material: Beryllium Copper
Plating: Gold
Plating - Thickness: -
Attachment Method: Solder
Operating Temperature: -
Shelf Life Start: -
Shelf Life: 12 Months
Storage/Refrigeration Temperature: 50°F~77°F(10°C~25°C)

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